South Korean technology giant Samsung is taking an important step in the semiconductor industry. The company begins to scale the DDR5 memory modules up to 1 TB.
With the developments in computer systems and components, the need for higher memory solutions becomes a much more important requirement in today’s world. Intel’s 13th generation Core processors and AMD’s Ryzen 7000 processors will gradually become the main current. Samsung has already exceeded some touchstones in this area.
Most standard consumers will access DDR5 memory up to 32 GB in their systems, but Samsung also offers solutions to corporate customers. In this context, significant improvements are experienced for DDR5 memory developed for server and HPC systems. Samsung has already reached 64 GB, 128 GB, 512 GB, and 768 GB. Now 1 TB DDR5 memory modules are being developed. Samsung’s DDR5 modules will first be used in systems based on AMD’s new generation EPYC ‘Genoa’ processors.
In the Samsung DDR5 memory, reduces the voltage to 1.1V and increases its frequencies to 7200mhz. Thanks to the double-ended chip capacities, the amount of higher memory is revealed. Samsung doubles the amount of capacity using 3DS 8H stacking technologies in DDR5 memory.